The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2013
Filed:
Aug. 28, 2012
Tomoyuki Fukuda, Aizuwakamatsu, JP;
Yoshihiro Kubota, Yokohama, JP;
Hiroshi Ohtsubo, Yokohama, JP;
Yuichi Asano, Aizuwakamatsu, JP;
Tomoyuki Fukuda, Aizuwakamatsu, JP;
Yoshihiro Kubota, Yokohama, JP;
Hiroshi Ohtsubo, Yokohama, JP;
Yuichi Asano, Aizuwakamatsu, JP;
Fujitsu Semiconductor Limited, Yokohama, JP;
Abstract
A BGA type semiconductor device includes: a substrate having wirings and electrodes; a semiconductor element disposed on the substrate, having a rectangular plan shape, and a plurality of electrodes disposed along each side of the semiconductor element; a plurality of wires connecting the electrodes on the semiconductor element with the electrodes on the substrate; a heat dissipation member disposed on the substrate, covering the semiconductor element, and having openings formed in areas facing apex portions of the plurality of wires connected to the electrodes formed along each side of the semiconductor element; and a sealing resin member for covering and sealing the semiconductor element and heat dissipation member.