The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2013
Filed:
Dec. 30, 2010
Takayuki Suzuki, Tokyo, JP;
Tomoyuki Saito, Tokyo, JP;
Masahiro Nakamura, Tokyo, JP;
Origin Electric Company, Limited, Tokyo, JP;
Abstract
It can prevent extension of the time required for bonding, even when relatively large members are bonded. a bonded member manufacturing apparatus comprises a first holderfor holding a first member D, a second holderfor holding a second member E, an application devicefor applying the intermediate substance G to a first bonded surface Df, a moving devicefor moving the first holderand/or the second holder, and a controller. The controller controls the first holder, the second holderand the moving deviceso that a first extended plane De and a second extended plane Ee are arranged such that the first extended plane De and the second extended plane Ee oppose each other in parallel and such that a range where the first bonded surface Df overlaps with the second bonded surface Ef is equal or smaller than a predetermined range when viewed in a direction of the thickness, and then so that the first member D is moved relatively to the second member E in a direction that the range where the first bonded surface Df overlaps with the second bonded surface Ef gradually increases when viewed in the direction of the thickness while maintaining a distance between the first extended plane De and the second extended plane Ee.