The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2013
Filed:
Jan. 29, 2010
Toshio Horie, Seto, JP;
Gaku Kitahara, Aichi-gun, JP;
Nobuaki Suzuki, Nisshin, JP;
Fumio Shimizu, Toyota, JP;
Takao Kobayashi, Seto, JP;
Ken-ichi Suzuki, Nagoya, JP;
Shigeki Oshima, Obu, JP;
Toshio Horie, Seto, JP;
Gaku Kitahara, Aichi-gun, JP;
Nobuaki Suzuki, Nisshin, JP;
Fumio Shimizu, Toyota, JP;
Takao Kobayashi, Seto, JP;
Ken-ichi Suzuki, Nagoya, JP;
Shigeki Oshima, Obu, JP;
Kabushiki Kaisha Toyota Chuo Kenkyusho, Aichi-gun, JP;
Abstract
A conductive film comprises a phosphide particle coated film formed by attaching raw material particles including phosphide particles comprising a compound of Ti and/or Fe, and P to a surface of a substrate material. This conductive film exhibits good corrosion resistant conductivity, and can be easily formed at low costs because of comprising the phosphide particle coated film. A corrosion-resistant conduction film comprises an iron-containing titanium phosphide layer containing Ti, Fe and P as essential basic elements. A corrosion-resistant conduction material having this corrosion-resistant conduction film on a surface of a substrate exhibits good corrosion resistance or conductivity. This corrosion-resistant conduction material can be obtained, for example, by a process comprising a plating step of forming an Ni plating layer on a surface of a Ti-based material substrate and a nitriding step of applying nitriding treatment to the Ti-based material substrate after the plating step at not more than 880 deg. C.