The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2013
Filed:
Apr. 11, 2011
Shinji Yoshihara, Nagoya, JP;
Kazushi Asami, Okazaki, JP;
Yasuhiro Kitamura, Chiryu, JP;
Junji Oohara, Nisshin, JP;
Shinji Yoshihara, Nagoya, JP;
Kazushi Asami, Okazaki, JP;
Yasuhiro Kitamura, Chiryu, JP;
Junji Oohara, Nisshin, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
In a manufacturing method for a semiconductor device having a coil layer part on a substrate, two support substrates each having a flat surface are prepared, and a component member is formed on the flat surface of each of the support substrates. The component member includes a wiring portion having a predetermined pattern and an insulation film surrounding the wiring portion. The wiring portion is provided with a connecting portion exposing from the insulation film. A coil layer part is formed by opposing and bonding the component members formed on the support substrates to each other while applying pressure in a condition where the flat surfaces of the support substrates are parallel to each other. A coil is formed in the coil layer part by connecting the wiring portions through the connecting portions.