The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2013
Filed:
Jan. 24, 2013
Canon Kabushiki Kaisha, Tokyo, JP;
Hiroshi Kondo, Yokohama, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
An embedded semiconductor device substrate having a semiconductor device integrated therein is formed by disposing a semiconductor device in an opening provided on an insulating resin, and sandwiching the semiconductor device and the insulating resin with a front surface wiring layer and a rear surface wiring layer and performing heat pressing. Connection between bumps of the semiconductor device and the front surface wiring layer is made with a connection wiring pattern. The connection wiring pattern is formed by patterning a resist film by direct exposure thereof with a light beam, and then performing etching. Thereby, it becomes possible to absorb a mounting error of a semiconductor device to a printed wiring board and a positional error of electrodes between semiconductor devices accompanying the tendency of reduction of the pitch of a semiconductor device, and to perform electric connection with a wiring pattern securely.