The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8609511 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 17, 2013

Filed:

Aug. 29, 2011
Applicants:

Takashi Shirono, Tokyo, JP;

Kazumasa Tanida, Oita, JP;

Naoko Yamaguchi, Kanagawa, JP;

Satoshi Hongo, Oita, JP;

Tsuyoshi Matsumura, Oita, JP;

Inventors:

Takashi Shirono, Tokyo, JP;

Kazumasa Tanida, Oita, JP;

Naoko Yamaguchi, Kanagawa, JP;

Satoshi Hongo, Oita, JP;

Tsuyoshi Matsumura, Oita, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/46 (2006.01);
U.S. Cl.
CPC ...
Abstract

According to one embodiment, an insulation film is formed over the surface, backside, and sides of a first substrate. Next, the insulation film formed over the surface of the first substrate is removed. Then, a joining layer is formed over the surface of the first substrate, from which the insulation film has been removed. Subsequently, the first substrate is bonded to a second substrate via a joining layer.


Find Patent Forward Citations

Shirono, Takashi. (2013). Semiconductor device manufacturing method, semiconductor device, and camera module (U.S. Patent No. 8609511). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8609511

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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