The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2013
Filed:
Jun. 06, 2011
Applicant:
Eui-seong Hwang, Gyeonggi-do, KR;
Inventor:
Eui-Seong Hwang, Gyeonggi-do, KR;
Assignee:
Hynix Semiconductor Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for fabricating a semiconductor device includes etching a substrate to form trenches that separate active regions, forming an insulation layer having an opening to open a portion of a sidewall of each active region, forming a silicon layer pattern to gap-fill a portion of each trench and cover the opening in the insulation layer, forming a metal layer over the silicon layer pattern, and forming a metal silicide layer as buried bit lines, where the metal silicide layer is formed when the metal layer reacts with the silicon layer pattern.