The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2013
Filed:
Feb. 29, 2008
Jianwen Xu, Chandler, AZ (US);
Jianwen Xu, Chandler, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A structure () for holding an integrated circuit (IC) die () during packing includes a flexible structurally reinforced silicone adhesive film () and a mold frame (). The mold frame () adheres to an adhesive side () of the film (). A method () of packaging the IC die () includes placing the IC die () on the adhesive film () with its active surface () and bond pads () in contact with an adhesive side () of the film (). A molding compound () is dispensed over the IC die, and the IC die () is encapsulated using compression molding to form a compression molded encapsulant layer (). IC die () is subsequently released from the film () as a panel () of IC dies ().