The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2013
Filed:
Jan. 27, 2010
Kazuyuki Yamashita, Toyama, JP;
Takashi Onaga, Toyama, JP;
Satoshi Fujiki, Toyama, JP;
Hideki Morimoto, Toyama, JP;
Tutomu Obata, Toyama, JP;
Masayasu Suzuki, Toyama, JP;
Kazuyuki Yamashita, Toyama, JP;
Takashi Onaga, Toyama, JP;
Satoshi Fujiki, Toyama, JP;
Hideki Morimoto, Toyama, JP;
Tutomu Obata, Toyama, JP;
Masayasu Suzuki, Toyama, JP;
Richell Co., Ltd., , JP;
Toyama Prefecture, , JP;
Abstract
A method of producing a microproduct comprises: providing a resin composition including 30 to 90 wt % of a polypropylene-based resin and 10 to 70 wt % of a hydrogenated derivative of a block copolymer shown by 'X-Y' (X represents a polymer block immiscible with the polypropylene-based resin, Y represents an elastomeric polymer block of a conjugated diene that's miscible with the polypropylene-based resin after hydrogenation); attaching a silicon stamper to a mold cavity of an injection molding machine, the silicon stamper having micromachined features formed by etching the surface of a silicon plate; and precisely transferring the micromachined features of the silicon stamper to the resin composition by injecting the resin composition into the mold cavity, a resulting molded surface having recesses and/or protrusions that are 0.3 to 200 μm deep or tall and 0.3 to 100 μm wide.