The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2013

Filed:

Nov. 19, 2010
Applicants:

Hongren Gu, Sugar Land, TX (US);

Yiyan Chen, Sugar Land, TX (US);

Xiaowei Weng, Katy, TX (US);

Inventors:

Hongren Gu, Sugar Land, TX (US);

Yiyan Chen, Sugar Land, TX (US);

Xiaowei Weng, Katy, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
E21B 43/26 (2006.01); E21B 43/267 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention discloses a method of treating a subterranean formation of a well bore, that provides a first treatment fluid; subsequently, pumps the first treatment fluid to initiate a network of low conductivity fractures in the subterranean formation; provides a second treatment fluid comprising a second carrier fluid, a particulate blend including a first amount of particulates having a first average particle size between about 100 and 2000 μm and a second amount of particulates having a second average particle size between about three and twenty times smaller than the first average particle size, such that a packed volume fraction of the particulate blend exceeds 0.74; and subsequently, pumps the second treatment fluid to initiate at least one high conductivity fracture in the subterranean formation, wherein the high conductivity fracture has a conductivity higher than the average of the conductivity of the low conductivity fractures and connects the network of the low conductivity fractures.


Find Patent Forward Citations

Loading…