The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2013
Filed:
Jun. 19, 2009
Satoshi Yamamoto, Sakai, JP;
Mikio Kajiwara, Sakai, JP;
Ryohei Deguchi, Sakai, JP;
Toshio Ohkado, Himeji, JP;
Shuichi Shikai, Himeji, JP;
Susumu Nishikawa, Himeji, JP;
Satoshi Yamamoto, Sakai, JP;
Mikio Kajiwara, Sakai, JP;
Ryohei Deguchi, Sakai, JP;
Toshio Ohkado, Himeji, JP;
Shuichi Shikai, Himeji, JP;
Susumu Nishikawa, Himeji, JP;
Daikin Industries, Ltd., Osaka, JP;
Kogi Corporation, Hyogo, JP;
Abstract
A mold includes a first groove part and a second groove part. The first groove part extends with a constant length or a constant width from a center part to an outer circumferential part of the mold. The second groove part extends from a terminal end of the first groove part on an outer circumferential part side of the first groove and merges with any portion of the first groove part. A molding manufacturing method includes manufacturing a preform by semimolten die casting or semisolid die casting using the mold. The method may also include removing a portion of the preform corresponding to the second groove part.