The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2013
Filed:
Jun. 09, 2010
Hisamitsu Toshida, Toyota, JP;
Hisamitsu Toshida, Toyota, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;
Abstract
There are provided a crack determining device capable of determining, in real time and with precision, the fact that a crack has occurred in a solder layer, and a semiconductor device comprising same. A crack determining device of the present invention is a crack determining device that determines whether or not a crack has occurred in a solder layer with respect to a semiconductor device in which at least a semiconductor element is connected to a connectee member via the solder layer, the crack determining device comprising a generation part that generates a magnetic field and that is fixed to a member forming the semiconductor device, and a detection part that detects a magnitude of a magnetic field and that is disposed within the solder layer, wherein the magnetic field generated at the generation part is detected at the detection part, and it is determined that a crack has occurred in the solder layer if this magnitude of the magnetic field varies from a magnitude of the magnetic field detected before the crack occurred.