The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2013

Filed:

Apr. 17, 2012
Applicants:

Jiro Tsuchiya, Susono, JP;

Torahiko Sasaki, Mishima, JP;

Makoto Imai, Toyota, JP;

Hideki Tojima, Numazu, JP;

Tadakazu Harada, Susono, JP;

Tomoaki Mitsunaga, Susono, JP;

Inventors:

Jiro Tsuchiya, Susono, JP;

Torahiko Sasaki, Mishima, JP;

Makoto Imai, Toyota, JP;

Hideki Tojima, Numazu, JP;

Tadakazu Harada, Susono, JP;

Tomoaki Mitsunaga, Susono, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/10 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor module is disclosed that includes a semiconductor element, a capacitor configured to be electrically connected to the semiconductor element and a heat sink, wherein the semiconductor and the capacitor are stacked with each other via the heat sink, and wherein the semiconductor element is disposed in a position overlapping with the capacitor as viewed from a stack direction.


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