The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2013
Filed:
Jul. 28, 2010
Joo-yang Eom, Bucheon-si, KR;
O-seob Jeon, Woojangsan Hyundai Town, KR;
Seung-won Lim, Bucheon-si, KR;
Seung-yong Choi, Seoul, KR;
Joo-yang Eom, Bucheon-si, KR;
O-seob Jeon, Woojangsan Hyundai Town, KR;
Seung-won Lim, Bucheon-si, KR;
Seung-yong Choi, Seoul, KR;
Fairchild Korea Semiconductor, Ltd., Bucheon-si, KR;
Abstract
Provided are a heat sink package in which a semiconductor package and a heat sink are bound to each other and a method of fabricating the same. The heat sink package includes a heat sink having a cavity on an upper surface thereof; a metal layer formed on the bottom surface of the cavity; a solder paste layer formed on the metal layer; a substrate on the solder paste layer; and a lead and a semiconductor chip mounted on the substrate.