The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2013

Filed:

Jul. 27, 2005
Applicants:

Koji Kuno, Hamamatsu, JP;

Tatsuya Suzuki, Hamamatsu, JP;

Takeshi Sakamoto, Hamamatsu, JP;

Inventors:

Koji Kuno, Hamamatsu, JP;

Tatsuya Suzuki, Hamamatsu, JP;

Takeshi Sakamoto, Hamamatsu, JP;

Assignee:

Hamamatsu Photonics K.K., Hamamatsu-shi, Shizuoka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/42 (2006.01); H01L 21/301 (2006.01);
U.S. Cl.
CPC ...
Abstract

This laser processing method irradiates a substratewith laser light L while locating a light-converging point P within the substrate, so as to form a quality modified regionto become a starting point region for cutting within the substratealong a line to cut. Here, the laser light L is oscillated pulsewise along a desirable part RP in the line to cut, and continuously in a predetermined part RC in the line to cut. Consequently, the quality modified regionis formed within the substratealong the desirable part RP in the line to cut, whereas no quality modified regionis formed within the substratealong the predetermined part RC in the line to cut


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