The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8604354 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 10, 2013

Filed:

Dec. 22, 2009
Applicants:

Shoji Ito, Sakura, JP;

Tomofumi Kitada, Sakura, JP;

Tadanori Ominato, Sakura, JP;

Inventors:

Shoji Ito, Sakura, JP;

Tomofumi Kitada, Sakura, JP;

Tadanori Ominato, Sakura, JP;

Assignee:

Fujikura Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A printed wiring board including: an insulated substrate; a conductive circuit provided on one side of this insulated substrate; a cover layer covering the insulated substrate and the conductive circuit; and a conductive particle buried in this cover layer, wherein the conductive particle is buried in the cover layer so that the conductive particle contacts the conductive circuit and protrudes from the cover layer; and the conductive particle serves as an electric contact point.


Find Patent Forward Citations

Ito, Shoji. (2013). Printed wiring board, method of manufacturing printed wiring board, and method of connecting printed wiring board (U.S. Patent No. 8604354). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8604354

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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