The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2013
Filed:
Mar. 25, 2009
Multilayer circuit board, insulating sheet, and semiconductor package using multilayer circuit board
Hironori Maruyama, Tokyo, JP;
Hitoshi Kawaguchi, Tokyo, JP;
Hiroyuki Tanaka, Tokyo, JP;
Sumitomo Bakelite Co., Ltd., Tokyo, JP;
Abstract
Semiconductor chip mounting yield and semiconductor package reliability deteriorate due to warpage of a multilayer circuit board. A multilayer circuit board () using an interlayer insulating layer () can suppress warpage of the entire multilayer circuit board () by making the interlayer insulating layer () serve as a buffer material. In the multilayer circuit board () using the interlayer insulating layer (), conductor circuit layers () and interlayer insulating layers () are alternately arranged. The interlayer insulating layer () to be used in the multilayer circuit board () includes a first insulating layer and a second insulating layer having an elastic modulus higher than that of the first insulating layer.