The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2013
Filed:
Dec. 01, 2011
Miguel Omar Cortes Roque, Apodaca, MX;
Roberto Carlos Garcia Cardona, Cienega de Flores, MX;
Alonso Loa Almaguer, San Nicolas de los Garza, MX;
Robert Hugh Dobrow, McKinney, TX (US);
Hector Eloy Mendoza Alvarado, Monterrey, MX;
Alfredo Haros Hernandez, Monterrey, MX;
Antonio Leal Morales, Monterrey, MX;
Miguel Omar Cortes Roque, Apodaca, MX;
Roberto Carlos Garcia Cardona, Cienega de Flores, MX;
Alonso Loa Almaguer, San Nicolas de los Garza, MX;
Robert Hugh Dobrow, McKinney, TX (US);
Hector Eloy Mendoza Alvarado, Monterrey, MX;
Alfredo Haros Hernandez, Monterrey, MX;
Antonio Leal Morales, Monterrey, MX;
Grote Industries, Inc., Madison, IN (US);
Abstract
An electrical apparatus according to the present disclosure comprises a molded device having a molded portion and being formed via an overmolding process. The electrical apparatus includes a wire set at least partially overmolded within the device, the wire set having an outer sheath surrounding a plurality of wires. The molded portion surrounds a portion of the wire set. The electrical apparatus further includes polyurethane bonding material occurring between the outer sheath and the molded portion. The polyurethane bonding material bonds at least a portion of the wire set to the molded portion during the overmolding process.