The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2013

Filed:

Dec. 26, 2006
Applicants:

Tomokazu Niitsuma, Hiroshima, JP;

Minoru Tanaka, Hiroshima, JP;

Inventors:

Tomokazu Niitsuma, Hiroshima, JP;

Minoru Tanaka, Hiroshima, JP;

Assignee:

JMS Co., Ltd., Hiroshima, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 9/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat exchange moduleis formed by stacking pipe groups obtained by fixing a plurality of pipeswith use of pipe array holding membersto. Flow path forming membersare arranged on pipe groups in the uppermost and lowermost layers, and wallsandare provided so as to protrude from the outer-side pipe array holding members and the inner-side pipe array holding members. Flow path membersare provided between the wallsandadjacent to each other so as to allow through holesandto communicate with each other. The heat exchange moduleis housed in the housing, and while rotating the housing, a resin materialis filled into a space enclosed by the two inner-side pipe array holding members of each pipe group in the housing, interstices around the pipes present between an openingof the housing and the outer-side pipe array holding members, and interstices around the pipes present between an openingof the housing and the outer-side pipe array holding members.


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