The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8601683 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 10, 2013

Filed:

Apr. 19, 2006
Applicants:

Charles Cohn, Wayne, NJ (US);

Jeffrey M Klemovage, Whitehall, PA (US);

Inventors:

Charles Cohn, Wayne, NJ (US);

Jeffrey M Klemovage, Whitehall, PA (US);

Assignee:

Agere Systems LLC, Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides method of manufacture for a printed wiring board. The printed wiring board constructed according to the teachings of the present invention includes a printed wiring board dielectric layer having conductive foils located on at least two sides thereof. The printed wiring board further includes a solid core conductive material interconnecting the conductive foils.


Find Patent Forward Citations

Cohn, Charles. (2013). Method for electrical interconnection between printed wiring board layers using through holes with solid core conductive material (U.S. Patent No. 8601683). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8601683

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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