The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2013
Filed:
Apr. 13, 2009
Applicants:
Akira Maeda, Chiyoda-ku, JP;
Kenji Otsu, Chiyoda-ku, JP;
Akira Yamada, Chiyoda-ku, JP;
Inventors:
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A solder alloy includes 5 to 15% by mass of Sb, 3 to 8% by mass of Cu, 0.01 to 0.15% by mass of Ni, and 0.5 to 5% by mass of In. The remainder thereof includes Sn and unavoidable impurities. Thereby, highly reliable solder alloy and semiconductor device suppressing a fracture in a semiconductor element and improving crack resistance of a solder material can be obtained.
Quick Actions:
Maeda, Akira. (2013). Solder alloy and semiconductor device (U.S. Patent No. 8598707). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8598707
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile