The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2013
Filed:
Mar. 15, 2012
Keisuke Sato, Kyoto, JP;
Kouji Takemura, Osaka, JP;
Keisuke Sato, Kyoto, JP;
Kouji Takemura, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A semiconductor device has high reliability which suppresses a temperature rise of a set housing within an allowable range, and avoids an effect on a wiring on a package substrate due to thermal expansion of a heat dissipating member. The semiconductor device includes a semiconductor element, a package substrate, and a heat dissipating member. A first main surface of the semiconductor element faces an element-mounting surface of the package substrate and is connected to the package substrate. A main surface part of the heat dissipating member contacts a second main surface which is a back surface of first main surface of semiconductor element. A bonding part around a periphery of the main surface part is bonded to a bonding area of the element-mounting surface of the package substrate. A wiring on the package substrate is arranged at a portion other than the element-mounting surface, in a region of the bonding area.