The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2013
Filed:
Mar. 31, 2011
Andrew Hooper, Portland, OR (US);
David Barsic, Portland, OR (US);
Kelly J. Bruland, Portland, OR (US);
Daragh S. Finn, Beaverton, OR (US);
Lynn Sheehan, Vancouver, WA (US);
Xiaoyuan Peng, Portland, OR (US);
Yasu Osako, Lake Oswego, OR (US);
Jim Dumestre, Tigard, OR (US);
William J. Jordens, Beaverton, OR (US);
Andrew Hooper, Portland, OR (US);
David Barsic, Portland, OR (US);
Kelly J. Bruland, Portland, OR (US);
Daragh S. Finn, Beaverton, OR (US);
Lynn Sheehan, Vancouver, WA (US);
Xiaoyuan Peng, Portland, OR (US);
Yasu Osako, Lake Oswego, OR (US);
Jim Dumestre, Tigard, OR (US);
William J. Jordens, Beaverton, OR (US);
Electro Scientific Industries, Inc., Portland, OR (US);
Abstract
Tailored laser pulse shapes are used for processing workpieces. Laser dicing of semiconductor device wafers on die-attach film (DAF), for example, may use different tailored laser pulse shapes for scribing device layers down to a semiconductor substrate, dicing the semiconductor substrate, cutting the underlying DAF, and/or post processing of the upper die edges to increase die break strength. Different mono-shape laser pulse trains may be used for respective recipe steps or passes of a laser beam over a scribe line. In another embodiment, scribing a semiconductor device wafer includes only a single pass of a laser beam along a scribe line using a mixed-shape laser pulse train that includes at least two laser pulses that are different than one another. In addition, or in other embodiments, one or more tailored pulse shapes may be selected and provided to the workpiece on-the-fly. The selection may be based on sensor feedback.