The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2013
Filed:
Jan. 27, 2011
David M. Eaves, Redondo Beach, CA (US);
Xiang Zeng, Monterey Park, CA (US);
Kelly J. Hennig, Torrance, CA (US);
Patty Pei-ling Chang-chien, Redondo Beach, CA (US);
David M. Eaves, Redondo Beach, CA (US);
Xiang Zeng, Monterey Park, CA (US);
Kelly J. Hennig, Torrance, CA (US);
Patty Pei-Ling Chang-Chien, Redondo Beach, CA (US);
Northrop Grumman Systems Corporation, Falls Church, VA (US);
Abstract
A wafer-scale assembly circuit including a plurality of metal interconnect layers, where each metal layer includes patterned metal portions and where at least some of the patterned metal portions are RF signal lines. The circuit further includes at least one benzocyclobutene layer provided between two metal interconnect layers that includes at least one trench via formed around a perimeter of the benzocyclobutene layer at a circuit sealing ring, where the trench via provides a hermetic seal at the sealing ring. The benzocyclobutene layer also includes a plurality of stabilizing post vias formed through the benzocyclobutene layer adjacent to the trench via proximate to the sealing ring and extending around the perimeter of the benzocyclobutene layer, where the stabilizing vias operate to prevent the benzocyclobutene layer from shrinking in size.