The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2013

Filed:

Dec. 25, 2009
Applicants:

Ryouji Oda, Tokyo, JP;

Takeshi Ooishi, Tokyo, JP;

Inventors:

Ryouji Oda, Tokyo, JP;

Takeshi Ooishi, Tokyo, JP;

Assignee:

Zeon Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 53/02 (2006.01); C08F 295/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An object of the present invention is to provide a block copolymer composition containing an aromatic vinyl-conjugated diene-aromatic vinyl block copolymer, which is capable of achieving a high-level balance between a high elastic modulus and a small permanent set, and is capable of producing a highly isotropic molded product having uniform mechanical properties even when a molding method which is likely to cause molecular orientation, such as extrusion molding, is applied. The object is attained by providing a block copolymer composition comprising a block copolymer A represented by the following Formula (A) and a block copolymer B represented by the following Formula (B), wherein a weight ratio (A/B) between the block copolymer A and the block copolymer B is 36/64 to 85/15:12  (A)()  (B),in the Formulae (A) and (B), Ar1and Areach represent an aromatic vinyl polymer block having a weight average molecular weight of 6,000 to 15,000; Ar2represents an aromatic vinyl polymer block having a weight average molecular weight of 40,000 to 400,000; Wand Deach represent a conjugated diene polymer block having a vinyl bond content of 1 mol % to 20 mol %; X represents a residue of a coupling agent; and n represents an integer of 3 or greater.


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