The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2013
Filed:
Mar. 30, 2010
Kenichi Senda, Osaka, JP;
Kenichi Senda, Osaka, JP;
Kaneka Corporation, Osaka, JP;
Abstract
Disclosed is an expanded polypropylene copolymer resin particle whose base resin is a polypropylene random copolymer resin having a melting point of not more than 145° C., the base resin having a H/W ratio of not more than 8 where H (%) is a maximum height of an elution peak and W (° C.) is a peak width at half a height of the peak in an elution curve obtained from a differential value of eluted content measured by cross fractionation chromatography, and a ratio (Mw/Mn) of a weight-average molecular weight (Mw) and a number-average molecular weight (Mn) being not less than 3.5 in a molecular weight distribution measurement of a whole of eluted components. With such an expanded polypropylene copolymer resin particle, it is possible to provide expanded polypropylene copolymer resin particles which are capable of producing an in-mold expansion-molded article with a low molding heating vapor pressure, and which causes few deformation or shrinkage of an obtained in-mold expansion-molded article (i.e. having a broad molding heating temperature range) even if the in-mold expansion molding is carried out with a high molding heating vapor pressure and has a low decrease in physical properties such as compression strength.