The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2013

Filed:

Sep. 13, 2012
Applicants:

Takashi Fuyuki, Tokyo, JP;

Kenkichi Suzuki, Tokyo, JP;

Sadayuki Toda, Tokyo, JP;

Hisashi Koaizawa, Tokyo, JP;

Inventors:

Takashi Fuyuki, Tokyo, JP;

Kenkichi Suzuki, Tokyo, JP;

Sadayuki Toda, Tokyo, JP;

Hisashi Koaizawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a SOI substrate that can realize a composite device formed of a MOS integrated circuit and a passive device and can reduce a size and a manufacturing cost of a semiconductor device. There is provided a fiber SOI substratecomprising a fiberwith a polygonal cross section, and a semiconductor thin filmcrystallized after film formation on at least one surface of the fiber, and a plurality of groovesthat extend in a linear direction of the fiberand are arranged at intervals in a width direction are formed on a surface of the fiber


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