The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2013
Filed:
Feb. 01, 2012
Mems packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads
Rajen Chanchani, Albuquerque, NM (US);
Christopher Nordquist, Albuquerque, NM (US);
Roy H. Olsson, Albuquerque, NM (US);
Tracy C. Peterson, Albuquerque, NM (US);
Randy J. Shul, Albuquerque, NM (US);
Catalina Ahlers, Albuquerque, NM (US);
Thomas A. Plut, Albuquerque, NM (US);
Gary A. Patrizi, Albuquerque, NM (US);
Rajen Chanchani, Albuquerque, NM (US);
Christopher Nordquist, Albuquerque, NM (US);
Roy H. Olsson, Albuquerque, NM (US);
Tracy C. Peterson, Albuquerque, NM (US);
Randy J. Shul, Albuquerque, NM (US);
Catalina Ahlers, Albuquerque, NM (US);
Thomas A. Plut, Albuquerque, NM (US);
Gary A. Patrizi, Albuquerque, NM (US);
Sandia Corporation, Albuquerque, NM (US);
Abstract
In wafer-level packaging of microelectromechanical (MEMS) devices a lid wafer is bonded to a MEMS wafer in a predetermined aligned relationship. Portions of the lid wafer are removed to separate the lid wafer into lid portions that respectively correspond in alignment with MEMS devices on the MEMS wafer, and to expose areas of the MEMS wafer that respectively contain sets of bond pads respectively coupled to the MEMS devices.