The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2013

Filed:

Aug. 28, 2009
Applicants:

Roger J. Karnopp, Eagan, MN (US);

Kevin J. Thorson, Eagan, MN (US);

Gregory M. Drexler, Minnetonka, MN (US);

Inventors:

Roger J. Karnopp, Eagan, MN (US);

Kevin J. Thorson, Eagan, MN (US);

Gregory M. Drexler, Minnetonka, MN (US);

Assignee:

Lockheed Martin Corporation, Bethesda, MD (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

A flexible circuit assembly that integrates a first fiber optic die, for example a transmitter die, and a second fiber optic die, for example a receiver die, on a single flexible circuit. Alignment holes and the multiple die are accurately placed on a single flexible circuit. The precise placement of the alignment holes and the fiber optic die facilitate micron alignment accuracy to a mechanical transfer (MT) connector. Fiber optic die circuitry is electrically connected to the first fiber optic die and second fiber optic die and connected to the flexible circuit.


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