The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2013

Filed:

Nov. 21, 2011
Applicants:

Qing LI, Boulder, CO (US);

Jon J. Anderson, Boulder, CO (US);

James M. Artmeier, Boulder, CO (US);

Jeffrey A. Niemann, Boulder, CO (US);

Sumit Sur, Boulder, CO (US);

Inventors:

Qing Li, Boulder, CO (US);

Jon J. Anderson, Boulder, CO (US);

James M. Artmeier, Boulder, CO (US);

Jeffrey A. Niemann, Boulder, CO (US);

Sumit Sur, Boulder, CO (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/00 (2006.01); G06F 1/26 (2006.01); G06F 1/32 (2006.01);
U.S. Cl.
CPC ...
Abstract

Various embodiments of methods and systems for determining the thermal status of processing components within a portable computing device ('PCD') by measuring leakage current on power rails associated with the components are disclosed. One such method involves measuring current on a power rail after a processing component has entered a 'wait for interrupt' mode. Advantageously, because a processing component may “power down” in such a mode, any current remaining on the power rail associated with the processing component may be attributable to leakage current. Based on the measured leakage current, a thermal status of the processing component may be determined and thermal management policies consistent with the thermal status of the processing component implemented. Notably, it is an advantage of embodiments that the thermal status of a processing component within a PCD may be established without the need to leverage temperature sensors.


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