The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8594857 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 26, 2013

Filed:

May. 31, 2011
Applicants:

Chih-chien Lin, Taipei, TW;

Chien-an Chen, Taipei, TW;

Inventors:

Chih-Chien Lin, Taipei, TW;

Chien-An Chen, Taipei, TW;

Assignee:

Inventec Corporation, Taipei, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G05D 23/00 (2006.01); F28F 7/00 (2006.01); F28D 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A modulized heat-dissipation control method for a datacenter is provided. In this method, a temperature sensor is used to sense inner temperatures of multiple servers and CPU temperatures in the multiple servers. If any one of the CPU temperatures is abnormal, a flow of a first coolant is adjusted. If any one of the inner temperatures is abnormal, a rotating speed of a fan module is adjusted. If the rotating speed of the fan module has reached its maximum, a flow of a second coolant is adjusted.


Find Patent Forward Citations

Lin, Chih-Chien. (2013). Modulized heat-dissipation control method for datacenter (U.S. Patent No. 8594857). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8594857

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…