The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2013

Filed:

May. 26, 2010
Applicants:

Jian-hong Zeng, Shanghai, CN;

Shou-yu Hong, Shanghai, CN;

Nan YE, Shanghai, CN;

Wei Yang, Shanghai, CN;

Jian-ping Ying, Shanghai, CN;

Inventors:

Jian-Hong Zeng, Shanghai, CN;

Shou-Yu Hong, Shanghai, CN;

Nan Ye, Shanghai, CN;

Wei Yang, Shanghai, CN;

Jian-Ping Ying, Shanghai, CN;

Assignee:

Delta Electronics, Inc., Taoyuan Hsien, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01F 38/30 (2006.01); H01F 27/36 (2006.01); H01F 27/32 (2006.01); H01F 5/00 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
Abstract

A coil assembly includes at least one insulated wire and an electromagnetic interference shielding layer. The insulated wire is wound into a winding coil part. The winding coil part includes a first wire-outlet segment, a second wire-outlet segment and a central through-hole. The electromagnetic interference shielding layer is formed on the winding coil part for shielding the insulated wire. The electromagnetic interference shielding layer has lateral projection profile on the winding coil part. The electromagnetic interference shielding layer has a radial gap such that the electromagnetic interference shielding layer is a non-conducting loop.


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