The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2013

Filed:

Jul. 19, 2011
Applicants:

Ho-jin Lee, Yeongdeungpo-gu, KR;

Sung-dong Cho, Hwaseong-si, KR;

Se-young Jeong, Suwon-si, KR;

Yeong-lyeol Park, Yongin-si, KR;

Sin-woo Kang, Yeongdeungpo-gu, KR;

Inventors:

Ho-Jin Lee, Yeongdeungpo-gu, KR;

Sung-Dong Cho, Hwaseong-si, KR;

Se-Young Jeong, Suwon-si, KR;

Yeong-Lyeol Park, Yongin-si, KR;

Sin-Woo Kang, Yeongdeungpo-gu, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device may include a substrate and a through electrode. The substrate may have a first surface and a second surface opposite to the first surface, the substrate including circuit patterns formed on the first surface. The through electrode penetrates the substrate and may be electrically connected to the circuit pattern, the through electrode including a first plug that extends from the first surface in a thickness direction of the substrate and a second plug that extends from the second surface in the thickness direction of the substrate so as to be connected to the first plug.


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