The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2013
Filed:
Jun. 14, 2011
Hiromi Shigihara, Kanagawa, JP;
Akira Yajima, Kanagawa, JP;
Hisao Shigihara, Kanagawa, JP;
Hiroshi Tsukamoto, Kanagawa, JP;
Hiromi Shigihara, Kanagawa, JP;
Akira Yajima, Kanagawa, JP;
Hisao Shigihara, Kanagawa, JP;
Hiroshi Tsukamoto, Kanagawa, JP;
Renesas Electronics Corporation, Kawasaki-shi, JP;
Abstract
To suppress peeling of an Au pad for external coupling provided in a rewiring containing Cu as a main component. On the surface of a rewiring including a two-layer film in which a first Ni film is laminated on the top of a Cu film, a pad to which a wire is coupled is formed. The pad includes a two-layer film in which an Au film is laminated on the top of a second Ni film and formed integrally so as to cover the top surface and the side surface of the rewiring. Due to this, the area of contact between the rewiring and the pad increases, and therefore, the pad becomes difficult to be peeled off from the rewiring.