The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2013
Filed:
Oct. 23, 2009
Bruno Dehos, Grenoble, FR;
Bruno Lagoguez, Saint Martin d'Uriage, FR;
Bruno Dehos, Grenoble, FR;
Bruno Lagoguez, Saint Martin d'Uriage, FR;
STMicroelectronics (Grenoble) SAS, Grenoble, RE;
Abstract
A multi-layer substrate has a front face with external pads. An integrated-circuit chip is positioned inside of the multi-layer substrate. An electronic and/or electric component is also positioned inside of the substrate above the integrated-circuit chip. An electrical connection network is formed in the multi-layer substrate to selectively connect the integrated-circuit chip and component together and to the external pads. A first screen is positioned within the multi-layer substrate between the integrated-circuit chip and the electrical connection network, this first screen being connected by vias to the external pads. A second screen is position on a top (external) surface of the multi-layer substrate above the component and electrical connection network, this second screen being connected by vias to the external pads. The integrated-circuit chip is position to be inside the first and second screens.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile