The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2013
Filed:
Jul. 11, 2012
Tomoaki Uno, Kanagawa, JP;
Nobuyoshi Matsuura, Kanagawa, JP;
Yukihiro Sato, Kanagawa, JP;
Keiichi Okawa, Kanagawa, JP;
Tetsuya Kawashima, Hitachinaka, JP;
Kisho Ashida, Tokyo, JP;
Tomoaki Uno, Kanagawa, JP;
Nobuyoshi Matsuura, Kanagawa, JP;
Yukihiro Sato, Kanagawa, JP;
Keiichi Okawa, Kanagawa, JP;
Tetsuya Kawashima, Hitachinaka, JP;
Kisho Ashida, Tokyo, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
The electrical characteristics of a semiconductor device are enhanced. In the package of the semiconductor device, there are encapsulated first and second semiconductor chips with a power MOS-FET formed therein and a third semiconductor chip with a control circuit for controlling their operation formed therein. The bonding pads for source electrode of the first semiconductor chip on the high side are electrically connected to a die pad through a metal plate. The bonding pad for source electrode of the second semiconductor chip on the low side is electrically connected to lead wiring through a metal plate. The metal plate includes a first portion in contact with the bonding pad of the second semiconductor chip, a second portion extended from a short side of the first portion to the lead wiring, and a third portion extended from a long side of the first portion to the lead wiring.