The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2013
Filed:
Jul. 25, 2011
Applicant:
Fumikazu Yamaki, Osaka, JP;
Inventor:
Fumikazu Yamaki, Osaka, JP;
Assignee:
Sumitomo Electric Industries Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/16 (2006.01); H01L 23/48 (2006.01); H01L 29/20 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device and a process to form the semiconductor device are disclosed. The semiconductor device includes a Si substrate, active devices primarily made of nitride based compound semiconductor material, and passive devices. The Si substrate includes a via hole piercing from the back surface to the primary surface of the Si substrate. The active device is mounted on the primary surface so as to cover at least a portion of the via hole. The metal layer cover the whole back surface, inner surfaces of the via hole, and the back surface of the active device exposed in the via hole.