The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2013
Filed:
Feb. 23, 2012
Applicants:
Jee Soo Mok, Gyunggi-do, KR;
Je Gwang Yoo, Gyunggi-do, KR;
Eung Suek Lee, Gyunggi-do, KR;
Chang Sup Ryu, Gyunggi-do, KR;
Inventors:
Jee Soo Mok, Gyunggi-do, KR;
Je Gwang Yoo, Gyunggi-do, KR;
Eung Suek Lee, Gyunggi-do, KR;
Chang Sup Ryu, Gyunggi-do, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/26 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacturing a printed circuit board, including: applying a conductive paste including carbon nanotubes and a photosensitive binder on a bump-forming area of a circuit substrate having a circuit layer for transferring electrical signals; and patterning the conductive paste, thus forming bumps.