The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2013
Filed:
Mar. 19, 2009
Sylvia Monsheimer, Haltern am See, DE;
Maik Grebe, Bochum, DE;
Stefan Altkemper, Dorsten, DE;
Sigrid Hessel-geldmann, Haltern am See, DE;
Franz-erich Baumann, Duelmen, DE;
Kristiane Warnke, Recklinghausen, DE;
Heike Stemmer, Haltern am See, DE;
Joachim Muegge, Haltern am See, DE;
Michael Tuerke, Marl, DE;
Ulrich Simon, Herne, DE;
Sylvia Monsheimer, Haltern am See, DE;
Maik Grebe, Bochum, DE;
Stefan Altkemper, Dorsten, DE;
Sigrid Hessel-Geldmann, Haltern am See, DE;
Franz-Erich Baumann, Duelmen, DE;
Kristiane Warnke, Recklinghausen, DE;
Heike Stemmer, Haltern am See, DE;
Joachim Muegge, Haltern am See, DE;
Michael Tuerke, Marl, DE;
Ulrich Simon, Herne, DE;
Evonik Degussa GmbH, Essen, DE;
Abstract
A task often encountered in very recent times is the rapid provision of prototypes. Particularly suitable processes are those based on pulverulent materials and in which the desired structures are produced layer-by-layer through selective melting and solidification. The invention provides the constitution, production and use of a copolyamide powder which was produced using the following monomer units: a) laurolactam or ω-aminoundecanoic acid, and also b) dodecanedioic acid, and either c) decanediamine or dodecanediamine, in shaping processes, and also to moldings produced through a layer-by-layer process which selectively melts regions of a powder layer, using this specific powder. Once the regions previously melted layer-by-layer have been cooled and solidified, the molding can be removed from the powder bed. The moldless layer-by-layer processes for the production of components using the copolyamide powder result in simplified and more reliable conduct of the process and better recyclability.