The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2013
Filed:
Mar. 24, 2010
Hiroyuki Uematsu, Tokyo, JP;
Kenichi Kawabata, Tokyo, JP;
Kenji Nagase, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
Provided is a method for manufacturing a multilayer wiring board, whereby even if the multilayer wiring board suffers warping or irregularities, thin-film patterns with great uniformity that are to be used as a mask for forming a wiring layer can be obtained in a simple way. A primer-coated metal foilcomposed of a primer resin layerand a metal layeris placed on a surface of a double-face CCL, which is prepared by applying metal layersandonto the surfaces of a support base, and the primer-coated metal foiland the double-face CCLare bonded and the primer resin layeris cured. A via Vb is thereafter formed from the metal layerside, and a metal-plate layeris formed on the resulting metal layer. After that, the etched down metal-plate layerand the metal layerare patterned, and using the patterned layers as a mask, the primer resin layeris patterned. Using the patterned primer resin layeras a mask, the metal layerof the double-face CCLand the metal-plate layerare patterned to form a wiring pattern.