The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2013
Filed:
Mar. 02, 2009
Hye Sun Yoon, Seoul, KR;
Jae Bong Choi, Seoul, KR;
Eun Jung Lee, Seoul, KR;
Jung Ho Hwang, Seoul, KR;
Joon Wook Han, Seoul, KR;
Hye Sun Yoon, Seoul, KR;
Jae Bong Choi, Seoul, KR;
Eun Jung Lee, Seoul, KR;
Jung Ho Hwang, Seoul, KR;
Joon Wook Han, Seoul, KR;
LG Innotek Co., Ltd., Seoul, KR;
Abstract
Provided is a method of manufacturing a printed circuit board including, disposing first and second insulating members and first and second conductive films on both sides of a separating member to perform a thermocompression bonding process on the first and second insulating members and the first and second conductive films on the both sides of the separating member, so as to attach the first member to the second member with the separating member therebetween and attach the first insulating member to the first conductive film and attach the second insulating member to the second conductive film, selectively removing the first and second conductive films to form first and second circuit patterns, and cutting the separating member and the first and second insulating members to separate the first and second insulating members with the first and second circuit patterns from the separating member.