The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2013

Filed:

Aug. 29, 2008
Applicants:

John Brock, Cupertino, CA (US);

Brett William Degner, Cupertino, CA (US);

Dinesh Mathew, Cupertino, CA (US);

Thomas W. Wilson, Jr., Cupertino, CA (US);

Chris Ligtenberg, Cupertino, CA (US);

Keith Hendren, Cupertino, CA (US);

Steven Keiper, Cupertino, CA (US);

Eugene Kim, Cupertino, CA (US);

Inventors:

John Brock, Cupertino, CA (US);

Brett William Degner, Cupertino, CA (US);

Dinesh Mathew, Cupertino, CA (US);

Thomas W. Wilson, Jr., Cupertino, CA (US);

Chris Ligtenberg, Cupertino, CA (US);

Keith Hendren, Cupertino, CA (US);

Steven Keiper, Cupertino, CA (US);

Eugene Kim, Cupertino, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multi-layered cable consisting of three or more conductive layers separated by layers of dielectric and/or adhesive material. The bottom layer and the top layer may act as return path for the transmitted signals and as a shield to prevent interference between these and external electrical signals. Located between the bottom layer and the top layer, the middle layer may transmit desired signals through the flexible cable. The material selection and specifics of each of the layers should be selected so as to achieve a balance in which the desired electrical impedance and mechanical flexibility requirements are met. The cable may also include one or more vias connecting the bottom layer to the top layer, providing shielding all the way around the flex cable. An additional conductive sock may be used to improve shielding effectiveness of the top and bottom layer and to connect to I/O connector shells and the system Faraday cage.


Find Patent Forward Citations

Loading…