The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2013
Filed:
May. 27, 2010
Makoto Ogawa, Fukui, JP;
Akihiro Motoki, Fukui, JP;
Masahito Saruban, Fukui, JP;
Toshiyuki Iwanaga, Sabae, JP;
Shunsuke Takeuchi, Echizen, JP;
Kenichi Kawasaki, Echizen, JP;
Makoto Ogawa, Fukui, JP;
Akihiro Motoki, Fukui, JP;
Masahito Saruban, Fukui, JP;
Toshiyuki Iwanaga, Sabae, JP;
Shunsuke Takeuchi, Echizen, JP;
Kenichi Kawasaki, Echizen, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A method for manufacturing a laminated electronic component includes the steps of preparing a laminated component main body, the component main body including internal electrodes formed therein, and each of the internal electrodes being partially exposed on an external surface of the component main body, and forming an external terminal electrode on the external surface of the component main body such that the external terminal electrode is electrically connected to the internal electrodes. The step of forming the external terminal electrode includes the steps of forming a metal layer on exposed surfaces of the internal electrodes, applying a water repellant on a surface of the metal layer and a section of the external surface of the component main body at which an end edge of the metal layer is located, and then forming a conductive resin layer on the metal layer having the water repellant applied thereon.