The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2013
Filed:
Aug. 12, 2011
Makoto Ogawa, Nagaokakyo, JP;
Akihiro Motoki, Nagaokakyo, JP;
Takehisa Sasabayashi, Nagaokakyo, JP;
Takayuki Kayatani, Nagaokakyo, JP;
Makoto Ogawa, Nagaokakyo, JP;
Akihiro Motoki, Nagaokakyo, JP;
Takehisa Sasabayashi, Nagaokakyo, JP;
Takayuki Kayatani, Nagaokakyo, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
In a laminate type ceramic electronic component, when an external electrode for a laminated ceramic capacitor is formed directly by plating onto a surface of a component main body, the film that is directly plated may have a low fixing strength with respect to the component main body. As the external electrode, a first plating layer composed of a Ni—P plating film with a P content rate of about 9 weight % or more is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no P is formed on the first plating layer. Preferably, the first plating layer is formed by electroless plating, whereas the second plating layer is formed by electrolytic plating.