The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2013
Filed:
Jul. 30, 2009
Takashi Nakajima, Takasaki, JP;
Yoshiaki Kamiyama, Takasaki, JP;
Kenji Okabe, Takasaki, JP;
Yukihiro Noro, Takasaki, JP;
Tomomi Kobayashi, Takasaki, JP;
Yoshie Amamiya, Takasaki, JP;
Takashi Nakajima, Takasaki, JP;
Yoshiaki Kamiyama, Takasaki, JP;
Kenji Okabe, Takasaki, JP;
Yukihiro Noro, Takasaki, JP;
Tomomi Kobayashi, Takasaki, JP;
Yoshie Amamiya, Takasaki, JP;
Taiyo Yuden Co., Ltd., Tokyo, JP;
Abstract
Disclosed is a laminated inductor that has good direct current superimposition characteristics, does not cause a variation in temperature characteristics, suppresses the occurrence of delamination, and can be stably manufactured. Also disclosed are a method for manufacturing the laminated inductor and a laminated choke coil. A laminated inductor () for use as a choke coil in a power supply circuit includes a rectangular parallelepiped-shaped laminated chip () and at least one pair of external electrodes () that are provided at the end of the laminated chip () and are conductively connected to the end of a coil. The laminated chip () includes a plurality of magnetic material layers () formed of an Ni—Zn—Cu ferrite, a plurality of conductive layers (), which are laminated through the magnetic material layers () to constitute a coil, and at least one nonmagnetic layer () formed of a Ti—Ni—Cu—Mn—Zr—Ag-base dielectric material and formed in contact with a plurality of the magnetic material layers ().