The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2013

Filed:

Aug. 29, 2011
Applicant:

Kazuaki Mawatari, Beppu, JP;

Inventor:

Kazuaki Mawatari, Beppu, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

A solder joint between a trace () and an object (). The trace having a solderable surface (), a height (), and a width (), the trace including a bulge having a diameter () greater than the trace width, a surface area, and sidewalls, the sum of the bulge sidewall areas being no less than the bulge surface area. The object having a solderable surface (), a diameter () greater than the trace width. One end of the object soldered to the bulge, wherein the solder () adheres to the bulge surface area and the bulge sidewall areas.


Find Patent Forward Citations

Mawatari, Kazuaki. (2013). Semiconductor flip-chip system having three-dimensional solder joints (U.S. Patent No. 8587122). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8587122

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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