The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2013

Filed:

Oct. 27, 2011
Applicants:

You-fa Wang, Singapore, SG;

Sin-heng Lim, Singapore, SG;

Teck-chai Goh, Singapore, SG;

Soon-lee Tan, Singapore, SG;

Inventors:

You-Fa Wang, Singapore, SG;

Sin-Heng Lim, Singapore, SG;

Teck-Chai Goh, Singapore, SG;

Soon-Lee Tan, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/09 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated Sensing package structure includes a substrate made of IR blocking material. The substrate has a first receiving compartment and a second receiving compartment concavely formed on the top surface thereof. The first receiving compartment has a reflective layer formed on the surface of the inner wall thereof. A LED unit is disposed in the bottom portion of the first receiving compartment. A plurality of first conducting lines is electrically connected to the LED unit and extends to an outer surface of the substrate. An IR sensing chip is disposed in the second receiving compartment. A plurality of second conducting lines is electrically connected to the IR sensing chip and extends to an outer surface of the substrate. An IR block cover is covered on the top surface of the substrate, forming at least one opening corresponding to the IR sensing chip.


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