The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8587094 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 19, 2013

Filed:

May. 25, 2011
Applicant:

Hisao Kawasaki, Kanagawa-ken, JP;

Inventor:

Hisao Kawasaki, Kanagawa-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device having an active element and an MIM capacitor and a structure capable of reducing the number of the manufacturing steps thereof and a manufacturing method therefor are provided. The semiconductor device has a structure that the active element having an ohmic electrode and the MIM capacitor having a dielectric layer arranged between a lower electrode and an upper electrode are formed on a semiconductor substrate, wherein the lower electrode and ohmic electrode have the same structure. In an MMICin which an FET as an active element and the MIM capacitor are formed on a GaAs substrate, for example, a source electrodeand a drain electrode, which are ohmic electrodes of the FET, are manufactured simultaneously with a lower electrodeof the MIM capacitor. Here the electrodes are formed with the same metal.


Find Patent Forward Citations

Kawasaki, Hisao. (2013). Semiconductor device using a compound semiconductor subtrate (U.S. Patent No. 8587094). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8587094

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