The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2013
Filed:
Feb. 25, 2011
Tsuneo Aoi, Tokyo, JP;
Dai Fujiwara, Tokyo, JP;
Daisuke Muto, Tokyo, JP;
Hiromitsu Asai, Nagoya, JP;
Shinji Kouda, Kariya, JP;
Fumiaki Abe, Ichihara, JP;
Tsuneo Aoi, Tokyo, JP;
Dai Fujiwara, Tokyo, JP;
Daisuke Muto, Tokyo, JP;
Hiromitsu Asai, Nagoya, JP;
Shinji Kouda, Kariya, JP;
Fumiaki Abe, Ichihara, JP;
Furukawa Electric Co., Ltd., Tokyo, JP;
Denso Corporation, Kariya-shi, JP;
DIC Corporation, Tokyo, JP;
Abstract
An inverter surge-resistant insulated wire, having an enamel baked layer, an adhesive layer, and an extrusion-coated resin layer, around the outer periphery of a conductor, wherein the sum of the thickness of the enamel baked layer, the extrusion-coated resin layer, and the adhesive layer is 60 μm or more, wherein the thickness of the enamel baked layer is 50 μm or less, and wherein the extrusion-coated resin layer is formed from a polyphenylene sulfide resin composition, which contains a polyphenylene sulfide polymer having a melt viscosity at 300° C. of 100 Pa·s or more, 2 to 8 mass % of a thermoplastic elastomer, and an antioxidant, and which has a tensile modulus of elasticity at 25° C. of 2,500 MPa or more, and a tensile modulus of elasticity at 250° C. of 10 MPa or more.