The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2013
Filed:
May. 04, 2005
Yin Lye Foong, Milpitas, CA (US);
Cheng Sim Kee, Bayan Lepas Penang, MY;
Lay Hong Lee, Penang, MY;
Mohamed Suhaizal Bin Abu-hassan, Kedah, MY;
Yin Lye Foong, Milpitas, CA (US);
Cheng Sim Kee, Bayan Lepas Penang, MY;
Lay Hong Lee, Penang, MY;
Mohamed Suhaizal Bin Abu-Hassan, Kedah, MY;
Spansion LLC, Sunnyvale, CA (US);
Abstract
A multi-chip module and a method for manufacturing the multi-chip module that mitigates wire breakage. A first semiconductor chip is mounted and wirebonded to a support substrate. A spacer is coupled to the first semiconductor chip. A support material is disposed on the spacer and a second semiconductor chip is positioned on the support material. The second semiconductor chip is pressed into the support material squeezing it into a region adjacent the spacer and between the first and second semiconductor chips. Alternatively, the support material is disposed on the first semiconductor chip and a die attach material is disposed on the spacer. The second semiconductor chip is pressed into the die attach material and the support material, squeezing a portion of the support material over the spacer edges. Wirebonds are formed between the support substrate and the first and second semiconductor chips.